About Diffusion Furnace Refurbishment
Diffusion Furnace Refurbishment Capabilities
- Applicable Maker : TEL, KE (Kokusai Electrics), and etc.
- Wafer Size : 200mm, 300mm
- Process Capabilities : HCD ALD Nitride, ALD Nitride, MTO, DCS-MTO, BCD-POLY, NS-POLY / LT-POLY, SEED-POLY, TEOS, and etc.
- Software Capabilities : I/O Mapping, PLC Program, S/W & H/W Interlock
- Hardware Capabilities : Main heater, Junction box module, Main power box, Jacket & Tape heater, Non loadloack to Loadloack modiication, Loadlock to Non loadlock modification, Wafer transfer module, Manifold & Seal cap module change, Auto shutter module change, PCW module, and etc.
- Parts Installation : PCB (MFC D-NET Board, etc..), Temperature Controller (RCM, CVM), Fork & Wafer detection module, Jacket & Tape heater, Valve block heater, and etc
Diffusion Furnace Refurbishment Work Flow
- On-Site Diffusion Furnace Refurbishment
- Off-Site Diffusion Furnace Refurbishment
Diffusion Furnace Relocation
Coming Soon !!!
TEL Formula Refurbishment
Coming Soon !!!
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