Lasers in Semiconductor Manufacturing
Lasers find themselves in a position of utmost importance within semiconductor processing. They form part of some of the most robust and costly processing equipment in the industry. Applications include but are not exclusive to laser marking, cutting, annealing, scribing, wafer dicing, and metrology amongst other processes. Being a focal point within the industry, end users will find they share a responsibility and a common best interest in making sure their lasers are in fit condition to meet precise manufacturing goals.
Laser technology used in semiconductor manufacturing is quite consistent in terms of the need to cut, ablate, and perform at precise levels. They differ, however, in terms of tolerance and beam diameters. Not all lasers are suited for the same tasks, when some applications require very precise cutting, some are better for more pulse duration and power. Across the board, industry laser technology must accommodate for a wide range of materials and adhere to tight tolerances.
Laser Repair Services
O2 Technology offers repair for a wide assortment laser technology used in semiconductor manufacturing. From that assortment, we take special care of diode lasers, HeNe lasers, LDLS lasers and smash lasers, to name a few. While the repair process may vary depending on the laser at hand, typically we will conduct an incoming inspection/test, determine replacement or reuseable parts, and a final outgoing test for completion.
We are currently offering repair services for manufacturers including–but not limited to: AMAT, ASML, Canon, Hitachi, KLA, and Nikon laser equipment. Please do not hesitate to inquire for more information on repair or with specific model requests.
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